Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2006-09-14
2010-10-12
Vu, Hung (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S207000, C257S691000, C257SE23175, C257SE25012
Reexamination Certificate
active
07812444
ABSTRACT:
A semiconductor IC-embedded module100comprises a multilayer substrate101having first and second insulating layers101aand101b, and a controller IC012and memory IC103that are embedded in the multilayer substrate101. A wiring layer104is formed as an internal layer in the multilayer substrate101. Part of the wiring layer104constitutes a bus line104X. The controller IC102or memory IC103is embedded in the second insulating layer101b. First and second ground layers105aand105bare provided respectively in the first and second insulating layers101aand101b. The effect of noise generated by bus lines is reduced, and an additional reduction in noise and a decrease in size and thickness are achieved by laying out bus lines that connect the semiconductor ICs so that distances are minimized.
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Endo Toshikazu
Katsumata Masashi
Kawabata Ken-ichi
TDK Corporation
Vu Hung
Webb Vernon P
Wolff Kevin A.
Wolff Law Offices PLLC
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