Method for affixing adhesive tape to semiconductor wafer,...

Details Method for affixing adhesive tape to semiconductor wafer,... Method for affixing adhesive tape to semiconductor wafer,...

2007-02-02

2010-12-14

Koch, III, George R (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S230000, C156S247000

Reexamination Certificate

active

07850799

ABSTRACT:
In association with movement of an affixation roller, a movement position of the affixation roller is detected by a rotation sensor based on a rotation amount of a motor. A control device changes and controls an amount of an adhesive tape to be fed forcibly based on a result of the detection, and keeps a tensile force applied to the adhesive tape in the affixation of the adhesive tape to the semiconductor wafer within a preset range.

REFERENCES:
patent: 2004/0140039 (2004-07-01), Yamamoto
patent: 2007/0131344 (2007-06-01), Tsujimoto et al.
patent: 4-340746 (1992-11-01), None
patent: 10-330022 (1998-12-01), None
patent: 2004-025438 (2004-01-01), None
patent: 2004-221469 (2004-08-01), None
patent: 2005-236049 (2005-09-01), None
patent: WO-2005/036628 (2005-04-01), None
Notification of Reasons for Refusal for the Application No. 2006-045641 mailed Mar. 17, 2009.
Chinese Office Action for the Application No. 2007100798736 from China Patent Office dated Jun. 5, 2009.

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