Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-08-28
2009-06-23
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE21590
Reexamination Certificate
active
07550838
ABSTRACT:
A semiconductor device includes a first power supply which is disposed in a first direction, a first pad array which is disposed in the first direction, adjacent to the first power supply line, a second power supply line extending in the first direction, a first buffer circuit which is disposed between pads included in the first pad array, a second pad array which is disposed in the first direction, a third power supply line extending along the second pad array such that the second pad array is interposed between the second power supply line and the third power supply line, and a second buffer circuit which is disposed between pads included in the second pad array, and which is operated by a voltage between the second and third power supply lines.
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Jahan Bilkis
Kabushiki Kaisha Toshiba
Louie Wai-Sing
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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