Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2009-06-12
2009-12-29
Ta, Tho D (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S083000, C439S862000, C029S874000, C029S882000, C029S884000
Reexamination Certificate
active
07637751
ABSTRACT:
The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.
REFERENCES:
patent: 3995516 (1976-12-01), Boily et al.
patent: 4367576 (1983-01-01), Dickinson
patent: 4509885 (1985-04-01), Dickinson
patent: 4574442 (1986-03-01), Dickinson et al.
patent: 5979276 (1999-11-01), Blais et al.
patent: 6357137 (2002-03-01), Childs et al.
patent: 6560835 (2003-05-01), Porter et al.
patent: 6698325 (2004-03-01), Sprandel
patent: 6711976 (2004-03-01), Ostertag
patent: 6716037 (2004-04-01), Kung et al.
patent: 6787899 (2004-09-01), Rinella et al.
patent: 7024153 (2006-04-01), Weiner et al.
patent: 7025601 (2006-04-01), Dittmann et al.
patent: 7263771 (2007-09-01), Ochiai
patent: 7293995 (2007-11-01), Li
patent: 2003/0150645 (2003-08-01), Chiu
patent: 2004/0000428 (2004-01-01), Lii et al.
patent: 2004/0018753 (2004-01-01), Kung et al.
patent: 2004/0190245 (2004-09-01), Tirumala et al.
patent: 2007/0002549 (2007-01-01), Brusso et al.
patent: 2007/0020960 (2007-01-01), Williams
patent: 2007/0105406 (2007-05-01), Li
Intel Corporation
Ta Tho D
Tweet Kerry D.
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