Molding compounds having a controlled thermal coefficient of exp

Details Molding compounds having a controlled thermal coefficient of exp Molding compounds having a controlled thermal coefficient of exp

Filed on

1995-06-23

Date issued

1996-09-17

Examiner

Donovan, Lincoln

Patent Class

Electricity: conductors and insulators

SubClass

Boxes and housings

SubSubClass

Hermetic sealed envelope type

Other Related Categories

174 5061, H01J 500

Type

Patent

Status

active

Patent number

055570666

Description

ABSTRACT:
Plastic (or resinous) materials used to package (or support) electronic devices typically have thermal coefficients of expansion exceeding that of the device to be packaged. A "loading" material (agent) having a coefficient of expansion significantly less than the "base" plastic material (molding compound), less than that of the die, and preferably zero or negative over a temperature range of interest, is mixed with the "base" plastic material to produce a plastic molding compound with a lower overall thermal coefficient of expansion. Titanium dioxide, zirconium oxide and silicon are discussed as loading agents. The loading material is mixed into the plastic molding compound in sufficient quantity to ensure that the resulting mixture exhibits an overall thermal coefficient of expansion that is more closely matched to that of the electronic device. Reduction of the absolute thermal coefficient of expansion of the plastic material (independent of any matching criteria) additionally serves to reduce thermal stress cracking of plastic package bodies during rapid thermal cycling, such as occurs during vapor soldering.

REFERENCES:
patent: 4529755 (1985-07-01), Nishikawa et al.
patent: 5051813 (1991-09-01), Schneider et al.
patent: 5140109 (1992-08-01), Matsumoto et al.
patent: 5165986 (1992-11-01), Gardner

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