Heat sink with thermoelectric module

Details Heat sink with thermoelectric module Heat sink with thermoelectric module

2006-06-22

2009-06-30

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S718000, C062S003200, C062S003700, C165S080200, C165S080300, C174S016100, C174S016300, C257S720000, C257S722000

Reexamination Certificate

active

07554808

ABSTRACT:
An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.

REFERENCES:
patent: 4689659 (1987-08-01), Watanabe
patent: 2004/0108104 (2004-06-01), Luo
patent: 2005/0121776 (2005-06-01), Deppisch et al.
patent: 2006/0048519 (2006-03-01), Childress

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