Inverted J-lead for power devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S787000

Reexamination Certificate

active

07633140

ABSTRACT:
A semiconductor package includes a lead frame having a plurality of leads and a lead frame pad, the lead frame pad including a die coupled thereto, at least one of the plurality of leads having an external portion sloped upwards relative to a bottom surface of the package, metal connectors connecting the die to the plurality of leads, and a resin body encapsulating the die, metal connectors and at least a portion of the lead frame.

REFERENCES:
patent: 5428248 (1995-06-01), Cha
patent: 5801439 (1998-09-01), Fujisawa et al.
patent: 5834837 (1998-11-01), Song
patent: 5835988 (1998-11-01), Ishii
patent: 5977630 (1999-11-01), Woodworth et al.
patent: 5986209 (1999-11-01), Tandy
patent: 6111312 (2000-08-01), Hirumuta et al.
patent: 6137165 (2000-10-01), Thierry
patent: 6188021 (2001-02-01), Tandy
patent: 6242798 (2001-06-01), Cha et al.
patent: 6331738 (2001-12-01), Kimura
patent: 6433418 (2002-08-01), Fujisawa et al.
patent: 6483181 (2002-11-01), Chang et al.
patent: 6744133 (2004-06-01), Tanabe et al.
patent: 6798044 (2004-09-01), Joshi
patent: 6977431 (2005-12-01), Oh et al.

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