Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Reexamination Certificate
2005-09-27
2009-12-22
Ward, Jessica L (Department: 1793)
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
C228S179100, C228S124600, C257S779000, C438S612000
Reexamination Certificate
active
07635077
ABSTRACT:
A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having disposed thereon corresponding electrical contacts and a sensing element for sensing a physical property of a media applied to said sensing element. One or more bonding ring or portions are arranged on the die. The die electrical contact(s) and bonding ring(s) can be bonded substantially simultaneously, with conductive bonding material, to the corresponding substrate electrical contact(s) and a surface of said substrate, respectively, to thereby form a sensor. The bonding ring(s) form a pressure seal. The substrate can include corresponding bonding ring(s). The die can include an ASIC for compensating temperature effects on said pressure sensor.
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Saad Erin B
Smyth Matthew
Ward Jessica L
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