Polishing composition and polishing method using the same

Details Polishing composition and polishing method using the same Polishing composition and polishing method using the same

2007-06-28

2009-10-06

Marcheschi, Michael A (Department: 1793)

Abrasive tool making process, material, or composition

With inorganic material

Clay, silica, or silicate

C051S307000, C051S309000, C106S003000, C106S005000, C438S691000, C438S692000, C438S693000, C257SE21230

Reexamination Certificate

active

07597729

ABSTRACT:
A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition preferably further contains an alkali compound, a water-soluble polymer, or a chelating agent. The polishing composition is suitable for use in polishing an edge of an object such as a semiconductor substrate.

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