Polishing pad containing embedded liquid microelements and...

Details Polishing pad containing embedded liquid microelements and... Polishing pad containing embedded liquid microelements and...

2003-08-26

2009-08-25

Vo, Hai (Department: 1794)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

C428S319300, C428S319700, C428S143000, C428S147000, C428S402200, C451S527000, C451S533000, C051S296000, C051S297000

Reexamination Certificate

active

07579071

ABSTRACT:
A polishing pad is provided. The polishing pad includes a polishing layer composed of a polymeric matrix and liquid microelements embedded in the polymeric matrix. Open pores defined by the embedded liquid microelements are distributed across a surface of the polishing layer. Due to the microstructural open pores uniformly distributed across a surface of the polishing pad, a polishing operation can be performed at high precision. The polishing pad shows constant polishing performance during the polishing operation, can be stably used, and does not cause a wafer to be scratched. In addition, a method of manufacturing the polishing pad is provided. Since all components used to manufacture the polishing pad are in a liquid phase, manufacturing can be easily performed.

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