Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate
2005-03-31
2009-06-02
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
C257S680000, C257SE23177, C257SE25008, C438S082000, C313S512000
Reexamination Certificate
active
07541671
ABSTRACT:
An organic device package includes a flexible substrate having a topside and a bottom side. Further, the organic device package includes an organic electronic device having a first side and a second side disposed on the topside of the flexible substrate. In addition, the organic device package includes a first barrier layer disposed on the bottom side of the flexible substrate.
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“PCT Search Report for US2006002955; Dated May 10, 2006”; (5 pages).
Foust Donald Franklin
Liu Jie
Nealon William Francis
General Electric Company
Ingham John C
Patnode Patrick K.
Weiss Howard
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