Plating apparatus

Details Plating apparatus Plating apparatus

2005-05-06

2009-12-15

Wilkins, III, Harry D. (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C205S096000

Reexamination Certificate

active

07632382

ABSTRACT:
A plating apparatus has a frame configured to be placed on a substrate so that a plating bath is formed by the frame and the substrate. The frame includes a conductive core and a seal member covering the conductive core. The plating apparatus also has a non-conductive porous member configured to be immersed in an electrolytic plating solution held in the plating bath, a counter electrode disposed on the non-conductive porous member so as to face the substrate with a predetermined distance from the substrate, and a feed contact configured to be brought into contact with a peripheral portion of the substrate outside of the frame. The plating apparatus includes a power source operable to apply a voltage between the counter electrode and the substrate and a potential adjuster operable to control a potential of the conductive core of the frame with respect to a potential of the substrate.

REFERENCES:
patent: 4466864 (1984-08-01), Bacon et al.
patent: 6251236 (2001-06-01), Stevens
patent: 6517689 (2003-02-01), Hongo et al.
patent: 6632335 (2003-10-01), Kunisawa et al.
patent: 6767437 (2004-07-01), Matsuda et al.
patent: 6790763 (2004-09-01), Kondo et al.
patent: 7273535 (2007-09-01), Kovarsky et al.

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