Conductive ball arraying apparatus

Details Conductive ball arraying apparatus Conductive ball arraying apparatus

2007-12-04

2009-10-27

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

C228S033000, C228S245000, C228S246000

Reexamination Certificate

active

07607559

ABSTRACT:
A conductive ball arraying apparatus includes an arraying jig including conductive ball insertion parts in a predetermined array pattern, a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig, moving means that moves the arraying jig and the ball cup relatively, the moving means moving the ball cup relatively along a top surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig, floating means that floats the ball cup from the arraying jig, and vibrating means that vibrates the ball cup. The moving means moves the ball cup relatively along the top surface of the arraying jig while floating the ball cup from the arraying jig and vibrating the ball cup.

REFERENCES:
patent: 5655704 (1997-08-01), Sakemi et al.
patent: 6253992 (2001-07-01), Fjelstad
patent: 3271482 (2002-01-01), None
patent: 2006-303341 (2006-11-01), None

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