Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-10-07
2009-08-11
Tucker, Philip C (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S250000, C083S016000, C083S029000, C083S033000, C083S875000, C083S879000, C083S880000, C438S113000, C438S458000, C438S460000, C438S462000
Reexamination Certificate
active
07572350
ABSTRACT:
A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.
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Furui Toshikazu
Matsushita Naohisa
Fujitsu Limited
Mazumdar Sonya
Staas & Halsey , LLP
Tucker Philip C
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