Method of manufacturing a silicon slider by an alkaline etch

Details Method of manufacturing a silicon slider by an alkaline etch Method of manufacturing a silicon slider by an alkaline etch

2005-02-22

2009-10-27

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603150, C029S603160, C029S603180, C360S234300, C360S234400, C360S235400, C216S022000

Reexamination Certificate

active

07607214

ABSTRACT:
A slider for use in a magnetic data recording system that is constructed from a Si wafer by a method that saves valuable wafer real estate by minimizing kerf related to the cutting of the wafer into slider rows. The sliders are produced from a (110) oriented Si wafer, and the sliders are parsed into rows by a process that involves forming a mask having a trench or opening between the rows of sliders at the location of the desired cut and parallel to a vertical (111) plane of the wafer. The wafer is then exposed to KOH which removes wafer material in the vertical direction through the wafer without removing wafer material in the horizontal direction. The vertical removal of wafer material is due to the extreme preferential removal of the (110) surface Si over that of the (111) surface Si. This results in a narrow straight trench being formed. The KOH etch removal can form a trench or cut having a width of only 30 to 50 um through a 1 mm thick wafer.

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