Method for separating a minute sample from a work piece

Details Method for separating a minute sample from a work piece Method for separating a minute sample from a work piece

2007-07-09

2009-11-10

Berman, Jack I (Department: 2881)

Radiant energy

Methods including separation or nonradiant treatment of test...

C250S307000, C250S442110

Reexamination Certificate

active

07615745

ABSTRACT:
The invention pertains to a method for separating a minute sample (1) from a work piece (2). Such a method is routinely used in the semiconductor industry to obtain samples from wafers to be inspected in a TEM. It occurred to the inventor that approximately 20% of the obtained samples could not be properly finished (thinned) due to a misalignment of specimen carrier (6) and sample. It turned out that this misalignment is caused by the specimen carrier contacting the sample prior to welding. By not contacting the sample while welding, but leaving a small gap between specimen carrier and sample, this misalignment is avoided. To avoid movement of the specimen carrier during welding, due to e.g. vibration, the specimen carrier can be landed on the wafer on a position (8) close to the sample.

REFERENCES:
patent: 5270552 (1993-12-01), Ohnishi et al.
patent: 6452174 (2002-09-01), Hirose et al.
patent: 6960765 (2005-11-01), Tomimatsu et al.
patent: 7009188 (2006-03-01), Wang
patent: 7173253 (2007-02-01), Aiba
patent: 7268356 (2007-09-01), Shichi et al.
patent: 7301146 (2007-11-01), Tomimatsu et al.
patent: 7408178 (2008-08-01), Tappel

Affiliated with

Also associated with

Rating

Method for separating a minute sample from a work piece does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for separating a minute sample from a work piece, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for separating a minute sample from a work piece will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4124622