Thin plate formation method, thin plate and suspension...

Metal deforming – With temperature modification of tool or of specified...

Reexamination Certificate

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C072S342940, C029S603120

Reexamination Certificate

active

07624610

ABSTRACT:
Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area.

REFERENCES:
patent: 4330363 (1982-05-01), Biegesen et al.
patent: 4691241 (1987-09-01), Tomohisa et al.
patent: 5177343 (1993-01-01), Takenaka
patent: 5355252 (1994-10-01), Haraguchi
patent: 5622567 (1997-04-01), Kojima et al.
patent: 5712463 (1998-01-01), Singh et al.
patent: 5719374 (1998-02-01), Frackiewicz et al.
patent: 6011239 (2000-01-01), Singh et al.
patent: 6058132 (2000-05-01), Iso et al.
patent: 6086773 (2000-07-01), Dufresne et al.
patent: 6441385 (2002-08-01), Khlif
patent: 6640604 (2003-11-01), Matsushita
patent: 6806723 (2004-10-01), Maruyama et al.
patent: 6837092 (2005-01-01), Ubl et al.
patent: 6984802 (2006-01-01), Kuroiwa et al.
patent: 7021097 (2006-04-01), Ubl et al.
patent: 2002/0108427 (2002-08-01), Matsushita
patent: 2003/0021067 (2003-01-01), Chang et al.
patent: 2003/0154005 (2003-08-01), Wong et al.
patent: 2004/0074879 (2004-04-01), Shang
patent: 2006/0130552 (2006-06-01), Ubl et al.
patent: 1199661 (1998-11-01), None
patent: 60-231524 (1985-11-01), None
patent: 01-227279 (1989-09-01), None
patent: 05-189906 (1993-07-01), None
patent: 06-114443 (1994-04-01), None
patent: 7-77063 (1995-08-01), None
patent: 10-277650 (1998-10-01), None
patent: 2000-339894 (2000-12-01), None
Chinese Office Action dated Sep. 15, 2006, including a partial English-language translation.
Japanese Office Action issued Jan. 20, 2009 in corresponding Japanese Patent Application No. 2002-245887.

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