Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-05-04
2009-06-02
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S778000, C257S780000
Reexamination Certificate
active
07541681
ABSTRACT:
An interconnection structure includes an electrically conductive bump, wherein the electrically conductive bump has a metal body having a distal end. The metal body is free of solder. An outermost layer of diffusion solder is positioned on at least regions of the metal body of the electrically conductive bump.
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Banner & Witcoff , Ltd.
Clark S. V
Infineon - Technologies AG
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