Curable resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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C524S430000, C524S560000

Reexamination Certificate

active

07612127

ABSTRACT:
It is to provide a curable resin composition which is curable at room temperature, has fluidity, is excellent in workability and provides a cured product having high thermal conductivity and being excellent in flexibility.A curable resin composition comprising a (meth)acrylate monomer, an organic peroxide, a decomposition accelerator for the organic peroxide, and an inorganic filler, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 3 to 10 μm and from 30 to 70 μm, and the mode diameter is from 30 to 70 μm and the median diameter is from 5 to 40 μm.

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patent: 5700853 (1997-12-01), Yoshida et al.
patent: 2003/0032707 (2003-02-01), Hemmings et al.
patent: 199 21 876 (2000-06-01), None
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patent: 2001-139733 (2001-05-01), None
patent: 2001139733 (2001-05-01), None
patent: 2002-308919 (2002-10-01), None
patent: 2002308919 (2002-10-01), None
patent: 2003-342021 (2003-12-01), None
patent: WO 94/13464 (1994-06-01), None

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