Cooling structure using rigid movable elements

Details Cooling structure using rigid movable elements Cooling structure using rigid movable elements

2008-03-25

2009-06-09

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C165S080400, C165S080500, C257S714000

Reexamination Certificate

active

07545648

ABSTRACT:
An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structure consists of: a compressible backing; a plurality of rigid copper elements disposed between the backing and the processor; a first conformable heat-conducting layer disposed over the processor; a second conformable heat-conducting layer disposed between the compressible backing and the rigid elements; a liquid coolant; and a seal for containing the liquid coolant.

REFERENCES:
patent: 4226281 (1980-10-01), Chu
patent: 4415025 (1983-11-01), Horvath
patent: 4479140 (1984-10-01), Horvath
patent: 5022462 (1991-06-01), Flint et al.
patent: 5159531 (1992-10-01), Horvath et al.
patent: 5270902 (1993-12-01), Bellar et al.
patent: 5291371 (1994-03-01), Gruber et al.
patent: 5528456 (1996-06-01), Takahashi
patent: 5548090 (1996-08-01), Harris
patent: 5557501 (1996-09-01), DiStefano et al.
patent: 6081428 (2000-06-01), Fujimoto
patent: 6411513 (2002-06-01), Bedard
patent: 6462952 (2002-10-01), Ubukata et al.
patent: 7064953 (2006-06-01), Miller
patent: 7206203 (2007-04-01), Campbell et al.
patent: 7301770 (2007-11-01), Campbell et al.

Affiliated with

Also associated with

Rating

Cooling structure using rigid movable elements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling structure using rigid movable elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling structure using rigid movable elements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4114247