Heat dissipation device

Details Heat dissipation device Heat dissipation device

2006-10-27

2009-02-24

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S121000, C165S122000, C361S694000

Reexamination Certificate

active

07495912

ABSTRACT:
A heat dissipation device includes a heat sink (10) in thermal contact with a first heat-generating electronic component. A fan duct (30) receives the heat sink therein and has an inlet (350) and an outlet (302) at opposite sides thereof. A fan (20) is mounted in the fan duct at the inlet. A portion of airflow generated by the fan flows through the heat sink to cool the first heat-generating electronic component. A shutter (31) is mounted on the fan duct. Another portion of the airflow generated by the fan flows through the shutter to blow a second heat-generating electronic component located beside the first heat-generating electronic component and outside the fan duct.

REFERENCES:
patent: 6304445 (2001-10-01), Bollesen
patent: 6565428 (2003-05-01), Hsiao
patent: 7215548 (2007-05-01), Wu et al.
patent: 7363963 (2008-04-01), Wang et al.
patent: 2006/0274504 (2006-12-01), Yao et al.
patent: 2007/0091566 (2007-04-01), Sun
patent: 2007/0254584 (2007-11-01), Chang et al.
patent: 2007/0261822 (2007-11-01), Lin et al.
patent: 2008/0144286 (2008-06-01), Li et al.
patent: 2008/0151498 (2008-06-01), Zhang

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