Method for fabricating a metal protection layer on...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S831000, C029S842000, C029S852000, C205S118000, C205S125000, C174S260000, C174S262000, C361S792000

Reexamination Certificate

active

07627946

ABSTRACT:
This invention discloses a method for electroplating nickel/gold on electrically connecting pads on a substrate for chip package and structure thereof. The method comprises: forming a conductive film on a substrate circuit-patterned and defined with a circuit layer; forming on the substrate a resist with an opening for exposing a portion of the conductive film in an electrically connecting pad area intended for the circuit layer; removing a portion of the conductive film not covered with the resist; forming another resist on the substrate to cover a portion of the conductive film residually exposing from the resist; electroplating nickel/gold on at least one electrically connecting pad on the substrate such that the electrically connecting pad is electroplated with a nickel/gold layer; removing the resists and the conductive film thereunder; and forming a solder mask on the substrate, wherein the electrically connecting pad electroplated with the nickel/gold layer is exposed from the solder mask. The structure comprises a substrate circuit-patterned and defined with a circuit layer, wherein the circuit layer is provided with at least one electrically connecting pad exposed from a resist, the exposed surface of the electrically connecting pad is electroplated with a nickel/gold layer, and the substrate is spared with an electroplating wire for electroplating nickel/gold on the electrically connecting pad.

REFERENCES:
patent: 6291779 (2001-09-01), Lubert et al.
patent: 6576540 (2003-06-01), Chen et al.
patent: 7045460 (2006-05-01), Weng et al.
patent: 2003/0070931 (2003-04-01), Kitchens
patent: 2003/0188886 (2003-10-01), Fey et al.
patent: 515061 (2002-12-01), None

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