Sensor packaging method for a human contact interface

Details Sensor packaging method for a human contact interface Sensor packaging method for a human contact interface

2007-12-05

2009-11-17

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S841000, C345S174000, C073S756000

Reexamination Certificate

active

07617599

ABSTRACT:
Methods of packaging systems pressure-sensitive devices that are subject to human contact force are disclosed. The methods include coupling and attaching the sensing devices and at least one other integrated circuit to a substrate; applying and curing a relatively-soft, protective material over the sensing portion of the sensing device; positioning a covering tool over the cured material; applying and curing a relatively-hard, protective coating around the covering tool and the relatively-soft, protective material; and applying a second, relatively-soft, protective material in the void left by the withdrawn covering tool.

REFERENCES:
patent: 6401545 (2002-06-01), Monk et al.
patent: 7148882 (2006-12-01), Kamrath et al.
patent: 2005/0236644 (2005-10-01), Getten et al.
patent: 2007/0126130 (2007-06-01), Dehe et al.

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