Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2006-11-07
2009-02-24
Potter, Roy K (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S057000, C438S123000
Reexamination Certificate
active
07494838
ABSTRACT:
A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.
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Adachi Hiroshi
Omura Masayoshi
Saitoh Hiroshi
Sato Hideki
Shirasaka Kenichi
Dickstein , Shapiro, LLP.
Potter Roy K
Yamaha Corporation
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