Apparatus for hot embossing lithography

Details Apparatus for hot embossing lithography Apparatus for hot embossing lithography

2006-05-12

2009-02-17

Gupta, Yogendra (Department: 1791)

Plastic article or earthenware shaping or treating: apparatus

Means applying electrical or wave energy directly to work

Radiated energy

C425S385000, C425S403000

Reexamination Certificate

active

07491049

ABSTRACT:
An apparatus for hot embossing lithography includes a press mold (20), a substrate (10), a first heating device (40), a second heating device (40′), and a vacuum chamber (32). The press mold has a main body (21) and a number of relief structures (22) extending therefrom. The substrate (10′) is configured for holding a polymer thin film (30) to be pressed. The first heating device (40) is adapted for heating the press mold, while the second heating device (40′) is adapted for heating the polymer thin film on the substrate. The vacuum chamber (32) has an opening (33) through which a vapor (34) can be introduced into the chamber, in order to lower a surface energy of the press mold. The press mold and the substrate are accommodated in the vacuum chamber, and the press mold is aligned with the polymer thin film on the substrate.

REFERENCES:
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patent: 6325610 (2001-12-01), Chiu et al.
patent: 6696220 (2004-02-01), Bailey et al.
patent: 6780001 (2004-08-01), Eldridge et al.
patent: 7137803 (2006-11-01), Chou
patent: 7179079 (2007-02-01), Sreenivasan et al.

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