Method of manufacturing semiconductor sensor

Details Method of manufacturing semiconductor sensor Method of manufacturing semiconductor sensor

2006-10-24

2009-10-06

Nguyen, Khiem D (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S456000, C257SE21499

Reexamination Certificate

active

07598118

ABSTRACT:
A method of manufacturing a semiconductor sensor includes a forming step, a preparing step, a fixing step and a separating step. In the forming step, a plurality of caps made of resin is formed on a supporting substrate through a separable agent. Each of the caps has a cavity therein. In the preparing step, a semiconductor wafer is prepared, on which a plurality of sensor elements are formed. In the fixing step, the caps are fixed to the semiconductor wafer. Each cavity of the caps corresponds to each of the sensor elements. In the separating step, the separable agent and the supporting substrate are separated from the caps so as to leave the caps on the semiconductor wafer.

REFERENCES:
patent: 5668033 (1997-09-01), Ohara et al.
patent: 6310421 (2001-10-01), Morishima
patent: 6716666 (2004-04-01), Silverbrook
patent: 6806557 (2004-10-01), Ding
patent: 6812062 (2004-11-01), Silverbrook
patent: 6977189 (2005-12-01), Silverbrook
patent: 6979599 (2005-12-01), Silverbrook
patent: 6982189 (2006-01-01), Silverbrook
patent: 6989292 (2006-01-01), Silverbrook
patent: 7008819 (2006-03-01), Silverbrook
patent: 7026176 (2006-04-01), Silverbrook
patent: 7126216 (2006-10-01), Silverbrook
patent: 7173332 (2007-02-01), Silverbrook
patent: 7303976 (2007-12-01), Sand
patent: 2002/0088537 (2002-07-01), Silverbrook
patent: 2004/0025589 (2004-02-01), Kurle et al.
patent: 2007/0020807 (2007-01-01), Geefay et al.
patent: 103 15 068 (2004-08-01), None
patent: 102004004476 (2005-07-01), None
patent: A-2004-101528 (2004-04-01), None
Office Action issued on Jun. 12, 2008 in the corresponding German patent application 10 2006 052 693.7 (and English Translation).

Affiliated with

Also associated with

Rating

Method of manufacturing semiconductor sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor sensor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4106643