Methods and apparatuses for electrochemical deposition

Details Methods and apparatuses for electrochemical deposition Methods and apparatuses for electrochemical deposition

2005-03-04

2009-10-06

Nguyen, Nam X (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S280000, C204S297010, C205S147000

Reexamination Certificate

active

07597787

ABSTRACT:
Methods and apparatuses for electrochemically depositing a metal layer onto a substrate. An electrochemical deposition apparatus comprises a substrate holder assembly including a substrate chuck and a relatively soft cathode contact ring. The cathode contact ring comprises an inner portion and an outer portion, wherein the inner portion directly contacts the substrate. An anode is disposed in an electrolyte container. A power supply connects the substrate holder assembly and the anode.

REFERENCES:
patent: 4158612 (1979-06-01), Luch et al.
patent: 4240894 (1980-12-01), Adler
patent: 4502929 (1985-03-01), Stewart et al.
patent: 5480528 (1996-01-01), Bischoping et al.
patent: 6444101 (2002-09-01), Stevens et al.
patent: 6635157 (2003-10-01), Dordi et al.
patent: 2005/0056544 (2005-03-01), Liu et al.

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