Melt redistribution element for an injection molding apparatus

Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under... – With coupling between charger and mold

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C425S573000, C264S328800, C264S328120, C366S339000, C366S340000

Reexamination Certificate

active

07614872

ABSTRACT:
An injection molding apparatus having a manifold and several manifold melt channels communicating with several hot runner nozzles includes a melt redistribution element. The melt redistribution element is placed at specific locations along the melt channels to balance the uneven shear stress profile accumulated during the flow of a melt along the manifold channels. The melt redistribution element has an unobstructed central melt bore having at its inlet a narrowing tapered channel portion. The melt redistribution element also includes a helical melt pathway portion that surrounds the central melt bore. The incoming melt is first subjected to a pressure increase by the tapered portion that causes the melt to flow at a higher velocity through the central melt bore. The outer portion of the melt is forced to flow along the helical path and thus it changes direction multiple times and partially mixes with the melt flowing through the central melt bore. Accordingly, at the outlet of the melt redistribution element the shear stress profile is more evenly distributed than at the inlet of the redistribution element.

REFERENCES:
patent: 3635444 (1972-01-01), Potter
patent: 3696840 (1972-10-01), Odhner
patent: 4027857 (1977-06-01), Cunningham
patent: 4123496 (1978-10-01), Gallizia et al.
patent: 4292018 (1981-09-01), Beale
patent: 4299553 (1981-11-01), Swaroop
patent: 4303382 (1981-12-01), Gellert
patent: 4403933 (1983-09-01), Davis et al.
patent: 4443178 (1984-04-01), Fujita
patent: 4469649 (1984-09-01), Ibar
patent: 4781879 (1988-11-01), Oishi
patent: 4848920 (1989-07-01), Heathe et al.
patent: 4965028 (1990-10-01), Maus et al.
patent: 5069840 (1991-12-01), Arnott
patent: 5192556 (1993-03-01), Schmidt
patent: 5262119 (1993-11-01), Smith
patent: 5421715 (1995-06-01), Hofstetter et al.
patent: 5554395 (1996-09-01), Hume et al.
patent: 5605400 (1997-02-01), Kojima
patent: 5683731 (1997-11-01), Deardurff et al.
patent: 5688462 (1997-11-01), Salamon et al.
patent: 5783234 (1998-07-01), Teng
patent: 5916605 (1999-06-01), Swenson et al.
patent: 5941637 (1999-08-01), Maurer
patent: 5955121 (1999-09-01), Gellert et al.
patent: 6077470 (2000-06-01), Beaumont
patent: 6089468 (2000-07-01), Bouti
patent: 6235230 (2001-05-01), Puniello
patent: 6245278 (2001-06-01), Lausenhammer et al.
patent: 6349886 (2002-02-01), Bouti
patent: 6382528 (2002-05-01), Bouti
patent: 6450798 (2002-09-01), Choi et al.
patent: 6503438 (2003-01-01), Beaumont et al.
patent: 6544028 (2003-04-01), Wright et al.
patent: 6572361 (2003-06-01), Gould et al.
patent: 6796786 (2004-09-01), White et al.
patent: 7287977 (2007-10-01), Serniuck et al.
patent: 2002/0070288 (2002-06-01), Bouti
patent: 2002/0086086 (2002-07-01), Doyle et al.
patent: 2002/0149135 (2002-10-01), Choi et al.
patent: 2004/0047943 (2004-03-01), White et al.
patent: 2004/0130062 (2004-07-01), Sicilia
patent: 2004/0164459 (2004-08-01), Babin et al.
patent: 2004/0256768 (2004-12-01), Olaru
patent: 2004/0265422 (2004-12-01), Sabin et al.
patent: 2005/0238758 (2005-10-01), Ciccone et al.
patent: 1165525 (1984-04-01), None
patent: 20 17 710 (1970-10-01), None
patent: 3201710 (1982-08-01), None
patent: 0293756 (1988-12-01), None
patent: 0293756 (1989-12-01), None
patent: 0 779 140 (1997-06-01), None
patent: 963829 (1999-12-01), None
patent: 1140456 (2001-10-01), None
patent: 2-178012 (1990-07-01), None
patent: 10-006363 (1998-01-01), None
patent: WO 01/34365 (2001-05-01), None
patent: WO 03/008173 (2003-01-01), None
patent: WO 03/011443 (2003-02-01), None
patent: WO-03/035 358 (2003-05-01), None
Abraham D. Strook,Microsystems, Microfluidic Transport, and Colloid Science, published on Cornell University Website at <http://web1temp.cheme.cornell.edu/peopleevents/faculty/stroock/Research.htm>, date unknown.
Document entitledEfficient Spiral Flow 3-D Microchannel, published at <http://www.shoji.comm.waseda.ac.jp/˜mf/mfeg/Spiralflow.htm>, Shoji Laboratory, Waseda University, Japan, date unknown.
Abstract ofNozzle Tip Handles Quick Colour Changesfrom <www.tool-moldmaking.com>(Sep. 14, 2004), European Tool & Mould Making May/Jun. 2001, Husky Injection Molding Systems S.A.
News Release, Husky Injection Molding Systems Ltd.,Melt Mixing Technology Improves Part Quality, Aug. 9, 2001.
Abstract ofHot Runner Nozzle Increase Performancefrom <www.tool-moldmaking.com>(Sep. 14, 2004), European Tool & Mould Making Oct. 2001, Husky Injection Molding Systems S.A.
Abstract ofWhen Mixing It Is a Good Ideafrom <www.tool-moldmaking.com>(Sep. 14, 2004), European Tool & Mould Making Nov./Dec. 2001, Husky Injection Molding Systems S.A.
Abstract ofStable Melt Profile Means Uniform Part Qualityfrom <www.tool-moldmaking.com>(Sep. 14, 2004), European Tool & Mould Making Jul./Aug. 2002, Husky Injection Molding Systems S.A.
News Release, Husky Injection Molding Systems Ltd.,Husky Introduces Ultraflow for Ultra Hot Runner Nozzles, Jun. 23, 2003.
J. Blundy,Improving Shear Induced Imbalance in Hot Runner Systems, INCOE Corporation publication (Jun. 25, 2004).
News Release, Husky Injection Molding Systems Ltd.,New UltraFlow tip improves melt homogeneity and part quality, Oct. 20, 2004.
Beaumont, John P., et al., “Solving Mold Filling Imbalances in Multi-cavity Injection Molds”,Journal of Injection Molding Technology, (Jun. 1998, vol. 2, No. 2), 47-58.
Wright, Corin , “Improving Color Change in Hot Runner Molds”,Plastics Machinery&Auxiliaries, (Apr. 2003).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Melt redistribution element for an injection molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Melt redistribution element for an injection molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Melt redistribution element for an injection molding apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4102698

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.