Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2006-10-30
2009-06-02
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S700000, C257S713000, C257S741000, C257S773000, C257S776000, C257SE23181, C257SE23182
Reexamination Certificate
active
07541670
ABSTRACT:
The power semiconductor package includes a semiconductor mounting substrate, a mother case having an opening and containing the semiconductor mounting substrate therein, a securing member having a plurality of securing positions formed along a rim constituting the opening, and a screw terminal and a pin terminal secured at the rim and electrically connected to the semiconductor mounting substrate. The screw terminal and the pin terminal are each secured by the securing member at one of the plurality of securing positions thereof. Thus, the package can adapt to variation in shape and arrangement of terminals due to differences in circuit configuration and the like of the semiconductor apparatuses, and can reduce restriction on the layout within the enclosure.
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Clark Jasmine J
Mitsubishi Electric Corporation
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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