Methods and systems for packaging integrated circuits with...

Details Methods and systems for packaging integrated circuits with... Methods and systems for packaging integrated circuits with...

2008-07-02

2009-11-10

Quach, Tuan N. (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S113000, C438S381000, C438S614000, C257SE21508

Reexamination Certificate

active

07615407

ABSTRACT:
A method is described for packaging integrated circuit dice such that each package includes a die with an integrated passive component mounted to the active surface of the die.

REFERENCES:
patent: 6518161 (2003-02-01), Rajagopalan et al.
patent: 7176117 (2007-02-01), Huang
patent: 7245011 (2007-07-01), Liu
patent: 7439098 (2008-10-01), Yang et al.
patent: 2004/0127011 (2004-07-01), Huang et al.
FlipChip International, “Bump on I/O Process,” downloaded on Nov. 1, 2007 from http://www.flipchip.com/services/wafer—level/ultra—csp/bump—process.shtml.
FlipChip International, “Redistributed Process,” downloaded on Nov. 1, 2007 from http://www.flipchip.com/services/wafer—level—ultra—csp/redistributed—process.shtml.

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