Memory card molding apparatus and process

Details Memory card molding apparatus and process Memory card molding apparatus and process

2006-09-22

2009-11-17

Hug, Eric (Department: 1791)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

C425S117000, C425S121000, C425S127000, C425S129100

Reexamination Certificate

active

07618249

ABSTRACT:
A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is configured to receive the substrate, and a cavity plate configured to be clamped to the molding plate further comprises a plurality of molding cavities each constructed in the shape of the said carriers. The cavities are operative to create molded packages onto the carrier conforming to a shape of the memory card device without need for further forming of the molded compound after molding. Additionally, a nozzle on the surface of each cavity is operative to introduce molding material into the cavity in a direction that is substantially perpendicular to a plane of the substrate placed on the molding plate.

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