CMP apparatuses with polishing assemblies that provide for...

Abrading – Machine – Combined

Reexamination Certificate

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C451S288000, C451S446000, C451S527000, C451S533000, C451S550000

Reexamination Certificate

active

07632170

ABSTRACT:
Chemical mechanical planarization apparatuses with polishing assemblies that provide for the passive removal of slurry are provided. In accordance with an embodiment, a work piece polishing assembly comprises a polishing pad comprising a polishing surface and an exhaust aperture that extends through the polishing pad from the polishing surface and is configured to receive a slurry from the polishing surface. An underlying member is disposed underlying the polishing pad and comprises a peripheral surface. The underlying member comprises a channel that is in fluid communication with the aperture and that opens at the peripheral surface of the underlying member.

REFERENCES:
patent: 5658185 (1997-08-01), Morgan et al.
patent: 5876271 (1999-03-01), Oliver
patent: 6095904 (2000-08-01), Breivogel et al.
patent: 6572445 (2003-06-01), Laursen
patent: 6692338 (2004-02-01), Kirchner
patent: 6705928 (2004-03-01), Barns
patent: 7314402 (2008-01-01), Laursen et al.
International Search Report for International Patent Application No. PCT/US2007/073249, mailed Apr. 11, 2008.

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