Coating processes – Mold coating
Reexamination Certificate
2006-12-13
2009-10-20
Cleveland, Michael (Department: 1792)
Coating processes
Mold coating
C425S175000
Reexamination Certificate
active
07604836
ABSTRACT:
Methods of performing nanoimprint lithography are described. For one method, a master tool and a stamper tool are formed to provide nanometer-scale imprinting. A release layer comprised of a perfluoropolyether diacrylate material is formed on the master tool and the stamper tool. The master tool and the stamper tool are used to form patterns in resist material, such as hole or pillar patterns. The resist material as described herein has lower viscosity and lower surface tension than prior resist materials allowing for more uniform replication of the patterns.
REFERENCES:
patent: 3640219 (1972-02-01), Farnham et al.
patent: 4569962 (1986-02-01), Burguette et al.
patent: 4729938 (1988-03-01), Tajima et al.
patent: 4743300 (1988-05-01), Brinduse et al.
patent: 5300613 (1994-04-01), Kishita et al.
patent: 5306758 (1994-04-01), Pellerite
patent: 5342913 (1994-08-01), Takago et al.
patent: 5476752 (1995-12-01), Noguchi et al.
patent: 5589319 (1996-12-01), Katou et al.
patent: 5639820 (1997-06-01), Kubo et al.
patent: 5772905 (1998-06-01), Chou
patent: 6309580 (2001-10-01), Chou
patent: 6630287 (2003-10-01), Towata
patent: 6875475 (2005-04-01), Moran et al.
patent: 6897264 (2005-05-01), Lachowicz et al.
patent: 6897267 (2005-05-01), Narang et al.
patent: 6936194 (2005-08-01), Watts
patent: 7060774 (2006-06-01), Sparrowe et al.
patent: 2003/0091926 (2003-05-01), Shelnut
patent: 2003/0180467 (2003-09-01), Malik
patent: 2004/0044122 (2004-03-01), Boldt
patent: 2004/0046271 (2004-03-01), Watts
patent: 2004/0110856 (2004-06-01), Young et al.
patent: 2004/0137734 (2004-07-01), Chou et al.
patent: 2004/0202865 (2004-10-01), Homola et al.
patent: 2005/0043480 (2005-02-01), Osawa
patent: 2005/0084613 (2005-04-01), Wang et al.
patent: 2006/0240257 (2006-10-01), Schwantes et al.
patent: 2007/0018345 (2007-01-01), Chao et al.
patent: 10030016 (2002-01-01), None
patent: 2002283354 (2002-10-01), None
patent: 2002348370 (2002-12-01), None
patent: 2004351693 (2004-12-01), None
Jason P. Rolland et. al. Angew. Chem. Int. Ed. 43(2004) 5796-5799.
Colburn, M. et al., Step and Flash Imprint Lithography: A New Approach to High-Resolution Patterning, Proc. SPIE 3676(1), pp. 379-389 (1999).
Reuther, Freimut, Advanced Polymers and Resists—A Key to the Development of Nanoimprint Lithography, Journal of Photopolymer Science and Technology, vol. 18, No. 4, pp. 525-530 (2005).
Hiroshima, Hiroshi, Fidelity of Photo-Nanoimprint, Journal of Photopolymer Science and Technology, vol. 18, No. 4, pp. 537-542 (2005).
Colburn, Matthew et al., Characterization and Modeling of Volumetric and Mechanical Properties for Step and Flash Imprint Lithography Photopolymers, J.Vac.Sci.Technol. B 19(6), pp. 2685-2689 (2001).
Guo Xing-Cai
Kercher Dan S.
Marchon Bruno
Mate Charles M.
Wu Tsai-Wei
Cleveland Michael
Duft Bornsen & Fishman LLP
Eslami Tabassom Tadayyon
Hitachi Global Storage Technologies - Netherlands B.V.
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