Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-12-26
2009-06-23
Luu, Chuong Anh (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S680000, C257S700000, C257S713000
Reexamination Certificate
active
07550847
ABSTRACT:
Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second side opposite the first side includes forming a recess in a substrate, placing the microelectronic die in the recess formed in the substrate with the second side facing toward the substrate, and covering the first side of the microelectronic die with a dielectric layer after placing the microelectronic die in the recess. The substrate can include a thermal conductive substrate, such as a substrate comprised of copper and/or aluminum. The substrate can have a coefficient of thermal expansion at least approximately equal to the coefficient of thermal expansion of the microelectronic die or a printed circuit board.
REFERENCES:
patent: 4903185 (1990-02-01), Fiorina et al.
patent: 4931853 (1990-06-01), Ohuchi et al.
patent: 5000821 (1991-03-01), Bostjancic
patent: 5008213 (1991-04-01), Kolesar, Jr.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5400986 (1995-03-01), Amore et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5805184 (1998-09-01), Horiike et al.
patent: 5851845 (1998-12-01), Wood et al.
patent: 5903371 (1999-05-01), Arecco et al.
patent: 5904655 (1999-05-01), Brackett
patent: 5933713 (1999-08-01), Farnworth
patent: 5946553 (1999-08-01), Wood et al.
patent: 6000486 (1999-12-01), Romick et al.
patent: 6000807 (1999-12-01), Moreland
patent: 6002062 (1999-12-01), Michel et al.
patent: 6004867 (1999-12-01), Kim et al.
patent: 6007223 (1999-12-01), Futami et al.
patent: 6008070 (1999-12-01), Farnworth
patent: 6020624 (2000-02-01), Wood et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6102463 (2000-08-01), Swanson et al.
patent: 6124634 (2000-09-01), Akram et al.
patent: 6184465 (2001-02-01), Corisis
patent: 6187615 (2001-02-01), Kim et al.
patent: 6225695 (2001-05-01), Chia et al.
patent: 6228687 (2001-05-01), Akram et al.
patent: 6235552 (2001-05-01), Kwon et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6326697 (2001-12-01), Farnworth
patent: 6326698 (2001-12-01), Akram
patent: 6407381 (2002-06-01), Glenn et al.
patent: 6452255 (2002-09-01), Bayan et al.
patent: 6459163 (2002-10-01), Bai
patent: 6503780 (2003-01-01), Glenn et al.
patent: 6537848 (2003-03-01), Camenforte et al.
patent: 6709898 (2004-03-01), Ma et al.
patent: 7312101 (2007-12-01), Jiang et al.
patent: 2004/0135269 (2004-07-01), Otsuki
patent: 2004/0150101 (2004-08-01), Fraley et al.
patent: 2006/0030150 (2006-02-01), Jiang et al.
Brooks J. Michael
Jiang Tongbi
Luu Chuong Anh
Micro)n Technology, Inc.
Perkins Coie LLP
LandOfFree
Packaged microelectronic devices and methods for packaging... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaged microelectronic devices and methods for packaging..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged microelectronic devices and methods for packaging... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4095327