Electroplating cell with hydrodynamics facilitating more...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Controlling current distribution within bath

Reexamination Certificate

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C205S097000, C205S123000, C205S125000, C205S148000

Reexamination Certificate

active

07553401

ABSTRACT:
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.

REFERENCES:
patent: 5599437 (1997-02-01), Taylor et al.
patent: 5616246 (1997-04-01), Gagnon et al.
patent: 5776327 (1998-07-01), Botts et al.
patent: 5804057 (1998-09-01), Zhou et al.
patent: 5865971 (1999-02-01), Sunkara
patent: 6048584 (2000-04-01), Josefowicz
patent: 6080504 (2000-06-01), Taylor et al.
patent: 6203684 (2001-03-01), Taylor et al.
patent: 6210555 (2001-04-01), Taylor et al.
patent: 6221235 (2001-04-01), Gebhart
patent: 6303014 (2001-10-01), Taylor et al.
patent: 6309528 (2001-10-01), Taylor et al.
patent: 6319384 (2001-11-01), Taylor et al.
patent: 6402931 (2002-06-01), Zhou et al.
patent: 6524461 (2003-02-01), Taylor et al.
patent: 6551485 (2003-04-01), Taylor
patent: 6558231 (2003-05-01), Taylor
patent: 6610189 (2003-08-01), Wang et al.
patent: 6652727 (2003-11-01), Taylor et al.
patent: 6676825 (2004-01-01), Gebhart
patent: 6750144 (2004-06-01), Taylor
patent: 6818115 (2004-11-01), van Kempen et al.
patent: 6974530 (2005-12-01), Bonkass et al.
patent: 2002/0033341 (2002-03-01), Taylor et al.
patent: 2002/0038764 (2002-04-01), Taylor et al.
patent: 2003/0075450 (2003-04-01), Taylor et al.
patent: 2004/0004006 (2004-01-01), Taylor et al.
patent: 2004/0011666 (2004-01-01), Taylor et al.
patent: 2005/0178667 (2005-08-01), Wilson et al.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 152-153.
Dictionary.com definitions of “eductor” and “dampener”.
Schlesinger, M. et al.,Modern Electroplating, Fourth Edition, John Wiley & Sons, Inc. (2000).
Paunovic, M. et al.,Fundamentals of Electrochemical Deposition, John Wiley & Sons, Inc. (1998).
Ward, M. et al., “The effects of pulsed current in conjuction with eductor agitation for acid copper electroplating: A study for improved quality in PCB manufacture,”European PCB Convention, Munich, Germany (1999).
Weber, A., “The Importance of Plating Cell Design and Hydrodynamics for Repeatable Product Quality in Latest Generation Vertical Platers for the Galvanic Industry,”IPC Printed Circuits Expo, Long Beach, California (2003).
Chin, D-T et al., “Mass Transfer to an Impinging Jet Electrode,”J. Electrochem. Soc., 125, 9, pp. 1461-1470 (Sep. 1978).
Hsueh, K-L. et al., “Mass Transfer to a Cylindrical Surace from an Unsubmerged Impinging Jet,”J. Electrochem. Soc., vol. 133, No. 1, pp. 75-81 (Jan. 1986).
Hsueh, K-L. et al., “Mass Transfer of a Submerged Jet Impinging on a Cylindrical Surface,”J. Electrochem. Soc., vol. 133, No. 9, pp. 1845-1850 (Sep. 1986).
Ward, M. et al., “Novel Agitation for PCB Production: Use of Eductor Technology,”Trans. IMF, 76(4), pp. 121-126 (1998).
Ward, M. et al., “Exploitation of eductor agitation in copper electroplating,”Proc. SURFIN 1999, Cincinnati, Ohio, (Jun. 1999).
Chin, D-T. et al., Mass Transfer from an Oblique Impinging Slot Jet,J. Electrochem. Soc., vol. 138, No. 9, pp. 2643-2650 (Sep. 1991).
Carano, M., “Hole Preparation & Metallization of High Aspect Ratio, High Reliability Back Panels, Part 2,”Circuitree, pp. 10-22 (Feb. 2003).

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