Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2007-05-25
2009-12-15
Morgan, Eileen P. (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S060000, C451S287000, C451S446000
Reexamination Certificate
active
07632169
ABSTRACT:
An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce scratches due to the polishing by-product, and can suppress consumption of slurry to the minimum to realize cost reduction during running for mass production.In order to achieve the above object, the present invention provides a polishing method where a mechanism that suspends a member15aon a pad19surface to bring the member in contact with or cause the member to approach the pad19surface and supplies the slurry along the member15ato apply the slurry to the pad19surface is provided, a surface of the pad19applied for polishing has a plurality of grooves communicating from a central portion of a surface portion of the pad to an edge portion thereof, and a step of supplying pure water along the respective grooves during a polishing processing to remove polishing by-product from the edge portion to the outside of the pad19is provided.
REFERENCES:
patent: 5308438 (1994-05-01), Cote et al.
patent: 5709593 (1998-01-01), Guthrie et al.
patent: 5916010 (1999-06-01), Varian et al.
patent: 5928062 (1999-07-01), Miller et al.
patent: 6139406 (2000-10-01), Kennedy et al.
patent: 6371836 (2002-04-01), Brown et al.
patent: 6375791 (2002-04-01), Chiesl et al.
patent: 6685796 (2004-02-01), Lin et al.
patent: 6863770 (2005-03-01), Jae et al.
patent: 6887132 (2005-05-01), Kajiwara et al.
patent: 2004/0121710 (2004-06-01), Boyd
patent: 2006/0105678 (2006-05-01), Kohama et al.
patent: 2007/0087672 (2007-04-01), Benner
patent: 2004-063888 (2004-02-01), None
patent: 2005-177934 (2005-07-01), None
Fattibene Paul A.
Fattibene and Fattibene
Morgan Eileen P.
Tokyo Seimitsu Co. Ltd.
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