Manufacturing method of multilayer ceramic board

Details Manufacturing method of multilayer ceramic board Manufacturing method of multilayer ceramic board

2007-10-24

2009-10-13

Osele, Mark A (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089110

Reexamination Certificate

active

07601235

ABSTRACT:
A method for manufacturing a multilayer ceramic board prevents damage to a wiring conductor formed on the surface of a multilayer ceramic board fabricated via a non-contraction process. On at least one principal surface of a layered body made up of a plurality of board ceramic green sheets including ceramic material powder, contraction prevention green sheets including inorganic material powder which is not sintered at the baking temperature of the board ceramic green sheet are arranged such that along at least a portion of the outer circumference of the principal surface, the portion and a nearby portion thereof are exposed to form a compound layered body, the compound layered body is baked under a condition in which the ceramic material powder is sintered, and the inorganic material powder is not sintered, following which the contraction prevention green sheets are removed. With a multilayer ceramic board, protruding portions are formed along at least a portion of the outer circumference of a principal surface.

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Official communication issued in the International Application No. PCT/JP2006/319780, mailed on Dec. 19, 2006.
Official communication issued in counterpart Korean Application No. 10-2007-7017682, mailed on Aug. 29, 2008.
English Translation and copy of official communication issued in Chinese Application No. 2006800062266, mailed on Jun. 26, 2009.

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