Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-06-23
2009-12-01
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S715000, C257S718000, C257S719000
Reexamination Certificate
active
07626823
ABSTRACT:
A heat sink assembly includes a first heat sink, a second heat sink, and a wire clip connecting the first and second heat sinks together. Each of the first and second heat sinks includes a base and a plurality of connecting members extending upwardly from the base. The wire clip includes a pivot portion and a pair of pressing portions extending from opposite ends of the pivot portion towards each other. The connecting members of the first and second heat sinks cooperatively clasp the pivot portion of the wire clip. The pressing members of the wire clip resiliently abut against the connecting members of the first and second heat sinks and push the connecting members of the first and second heat sink outwardly away from each other. The bases of the first and second heat sinks clamp an add-on card therebetween.
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patent: 7312996 (2007-12-01), Chang
patent: 7349220 (2008-03-01), Lai et al.
patent: 7400506 (2008-07-01), Hoss et al.
patent: 2003/0026076 (2003-02-01), Wei
patent: 2009/0103269 (2009-04-01), Liu et al.
Yang Jian
Zhang Jing
Chervinsky Boris L
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Niranjan Frank R.
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