Method of correcting opaque defect of photomask using atomic...

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Reexamination Certificate

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Reexamination Certificate

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07571639

ABSTRACT:
An opaque defect is processed by scanning with a high load or height fixed mode using a probe harder than a pattern material of a photomask at the time of going scanning, and is observed by scanning with a low load or intermittent contact mode at the time of returning scanning so as to detect an ending point of the opaque defect by the height information. When there is a portion reaching to a glass substrate as an ending point, this portion is not scanned by the high load or height fixed mode in the next processing, and only a portion not reaching to the ending point is scanned by the high load or height fixed mode.

REFERENCES:
patent: 7107826 (2006-09-01), Watanabe et al.
patent: 2006/0254347 (2006-11-01), Watanabe et al.
patent: 2006/0254348 (2006-11-01), Watanabe et al.
Y. Morikawa et al. “Defect repair performance using the nanomachining repair technique”, Proc. Of SPIE 5130 P520-527 (2003).

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