Method and apparatus for detection of failures in a wafer...

Details Method and apparatus for detection of failures in a wafer... Method and apparatus for detection of failures in a wafer...

2006-01-10

2009-10-13

Chang, Jon (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C382S199000, C382S203000

Reexamination Certificate

active

07602964

ABSTRACT:
Detecting spatial failures in a wafer can be performed quickly and accurately by using transformations and cluster signature analysis. For this technique, a system can receive failure coordinates for the wafer, wherein each failure coordinate indicates a spatial failure. A failure array can be generated based on a resolution of those failure coordinates. A first set of objects, e.g. linear and arc objects, can be detected in the failure array using transformations. A second set of objects, e.g. blob and scratch objects, can be detected in the failure array using cluster signature analysis. This technique advantageously reduces the amount of memory required to perform the analysis and increases the processing speed without increasing the error rate of detection.

REFERENCES:
patent: 6072900 (2000-06-01), Chiu et al.
patent: 6483938 (2002-11-01), Hennessey et al.
patent: 2001/0021276 (2001-09-01), Zhou
patent: 2002/0114518 (2002-08-01), Wilt

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