Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-06-17
2009-06-02
Picardat, Kevin M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S670000, C257S672000, C257S782000, C257S783000, C257S787000
Reexamination Certificate
active
07541667
ABSTRACT:
A manufacturing method of a semiconductor device including preparing a lead frame having a die pad, leads arranged around the die pad and a silver plating layer formed over a first portion of each of the leads, mounting a semiconductor chip over a main surface of the die pad with a rear surface of the chip fixed to the main surface of the die pad, electrically connecting electrodes of the chip with the leads through wires, forming a molding resin sealing the die pad, the first portion, the semiconductor chip, and the wires, and forming a lead-free solder plating layer over a second portion of each of the leads exposed from the molding resin. An area of the die pad is smaller than an area of the chip, and a part of the molding resin contacts with the rear surface of the chip exposed from the die pad.
REFERENCES:
patent: 4994411 (1991-02-01), Naito et al.
patent: 5424576 (1995-06-01), Djennas et al.
patent: 5429992 (1995-07-01), Abbott
patent: 5623123 (1997-04-01), Umehara
patent: 5905299 (1999-05-01), Lacap
patent: 5960260 (1999-09-01), Umehara
patent: 6081978 (2000-07-01), Utsumi
patent: 6087714 (2000-07-01), Kubara
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6291273 (2001-09-01), Miyaki
patent: 6340837 (2002-01-01), Miyaki et al.
patent: 6372351 (2002-04-01), Takemiya
patent: 6376905 (2002-04-01), Hisano
patent: 6395583 (2002-05-01), Kubara et al.
patent: 6441400 (2002-08-01), Miyaki
patent: 6454158 (2002-09-01), Takahashi
patent: 6479323 (2002-11-01), Lo et al.
patent: 2003/0001249 (2003-01-01), Shimanuki
patent: 05-270860 (1993-10-01), None
patent: 216303 (1994-08-01), None
patent: 8-204107 (1996-08-01), None
patent: 10-093004 (1998-04-01), None
patent: 11-179586 (1999-07-01), None
patent: 11-221694 (1999-08-01), None
patent: 11-330340 (1999-11-01), None
patent: 2000-77435 (2000-03-01), None
patent: 2000/307046 (2000-11-01), None
patent: 2001-230360 (2001-08-01), None
patent: WO98/29903 (1998-07-01), None
patent: WO 01/03186 (2001-01-01), None
Miyaki Yoshinori
Nishi Kunihiko
Suzuki Hiromichi
Suzuki Kazunari
Antonelli, Terry Stout & Kraus, LLP.
Au Bac H
Hitachi , Ltd.
Hitachi ULSI Systems Co. Ltd.
Picardat Kevin M
LandOfFree
Semiconductor device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4082154