Die down semiconductor package

Details Die down semiconductor package Die down semiconductor package

2005-04-01

2009-02-10

Norris, Jeremy C (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S762000, C361S763000, C361S764000, C361S765000, C361S767000, C174S263000

Reexamination Certificate

active

07489517

ABSTRACT:
A semiconductor package is disclosed for an integrated circuit die (52). The integrated circuit die is electrically connected to the package substrate by either die solder balls (53a), or wirebonds (53b). The package substrate (50), a single sided printed wiring board, has a thick metal core (100), consisting of a base metal, a core capacitor, and one or more thin build up layers.

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