Submicron particle removal using liquid nitrogen

Details Submicron particle removal using liquid nitrogen Submicron particle removal using liquid nitrogen

1995-05-10

1996-09-17

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

With spray or jet supplying and/or applying means

134105, 134902, B08B 302

Patent

active

055559026

ABSTRACT:
Liquid nitrogen is introduced onto a surface of a semiconductor wafer to remove submicron particles from its surface. LN.sub.2 flows across the wafer surface wherein the surface tension of the liquid collects contaminant particles and removes them off the edge of the wafer.

REFERENCES:
patent: 4027686 (1977-06-01), Shortes et al.
patent: 4409034 (1983-10-01), Williams
patent: 4491484 (1985-01-01), Williams
patent: 4554025 (1985-11-01), Burke et al.
patent: 4788994 (1988-12-01), Shinbara
patent: 4817652 (1989-04-01), Liu et al.
patent: 4871417 (1989-10-01), Nishizawa et al.
patent: 4962776 (1990-10-01), Liu et al.
patent: 5020200 (1991-06-01), Mimasaka et al.
patent: 5022419 (1991-06-01), Thompson et al.
patent: 5062898 (1991-11-01), McDermott et al.
patent: 5213619 (1993-05-01), Jackson et al.
patent: 5316591 (1994-05-01), Chao et al.
patent: 5355901 (1994-10-01), Mielnik et al.
"Surface Cleaning by a Cryogenic Argon Aerosol", McDermott et al., 1991 Proceedings-Institute of Environmental Sciences, pp. 882-885.
"Temperature-Dependent Van Der Waals Forces", V. A. Parsegian et al., Biophysical Journal 10, pp. 664-674 (1970).
"Ice Scrubber Cleaning", Toshiaka Ohmori et al., Technical Proceedings Semicon/Kansai-Kyoto, Jun. 21-23, 1990, pp. 142-149.

Affiliated with

Also associated with

Rating

Submicron particle removal using liquid nitrogen does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Submicron particle removal using liquid nitrogen, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Submicron particle removal using liquid nitrogen will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-407829