Workpiece processing device

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S247000, C156S249000, C156S345420, C156S384000, C156S538000, C156S583200, C414S935000, C438S976000

Reexamination Certificate

active

07490650

ABSTRACT:
A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.

REFERENCES:
patent: 4696712 (1987-09-01), Nonaka
patent: 5118369 (1992-06-01), Shamir
patent: 6249943 (2001-06-01), Matsushita et al.
patent: 6946311 (2005-09-01), Kawashima
patent: 2001/0010972 (2001-08-01), Robinson et al.
patent: 2004/0074607 (2004-04-01), Hayasaka et al.
patent: 2006/0068524 (2006-03-01), Yamamoto
patent: 2006/0219359 (2006-10-01), Miyamoto et al.
patent: 2007/0162175 (2007-07-01), Segawa et al.
patent: 2007/0187036 (2007-08-01), Ametani
patent: 1 310 432 (2006-02-01), None
patent: 62-8966 (1987-01-01), None
patent: 11-074231 (1999-03-01), None
patent: 2000-68293 (2000-03-01), None
patent: 2002-343756 (2002-11-01), None
patent: 2005-317711 (2005-11-01), None
patent: 2006-35159 (2006-02-01), None
patent: 2007-214496 (2007-08-01), None
patent: 20020026668 (2002-04-01), None
patent: 2002-0089180 (2002-11-01), None
Patent Abstracts of Japan, Publication No. 2000-068293, Published on Mar. 3, 2000, in the name of Tsujimoto, et al.
Australian Patent Office Search Report, mailed Oct. 8, 2007, for Application No. SG 200703938-1, in the name of Tokyo Seimitsu Co., Ltd. (JP).
Patent Abstracts of Japan, Publication No. 62-008966; Date of Publication: Jan. 16, 1987; in the name of Minoru Ametani, et al.
Patent Abstracts of Japan, with English translation of patent application; Publication No. 2002-343756; Date of Publication: Nov. 29, 2002; in the name of Kazuo Kobayashi.
Patent Abstracts of Japan, with English translation of patent application; Publication No. 2005-317711; Date of Publication: Nov. 10, 2005; in the name of Masaki Tsujimoto et al.
Australian Search Report dated Mar. 21, 2007 corresponding to related application No. 200700265.2.
Office action corresponding to a related application, with English translation, dated Jan. 30, 2008, for KR patent application No. 10-2007-0013959, indicating the relevance of JP 62-8966 and KR 2002-89180.
English translation of Japan Patent Publication JP 2007-214496 listed above which corresponds to Japan Patent Application JP 2006-35159 previously filed as “On Order” in the May 22, 2007 IDS.
U.S. Office action for related U.S. Appl. No. 11/704,454, indicating relevance of U.S. Publication 2006/0068524 listed above.
English translation of Japan Publication JP 11-074231 listed above, no date.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Workpiece processing device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Workpiece processing device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Workpiece processing device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4075637

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.