Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-08-04
2009-08-04
Hu, Shouxiang (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S703000, C257S790000, C257S791000
Reexamination Certificate
active
07569925
ABSTRACT:
A module with a built-in component is produced by disposing a cavity on a mounting surface side of a ceramic multilayer substrate, storing a circuit component therein and, thereafter, performing resin molding. A second resin portion is disposed on the mounting surface side of the ceramic multilayer substrate so as to continuously cover a frame-shaped portion and a first resin portion molded. External terminal electrodes are disposed on an outer surface of the second resin portion.
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International Search Report issued in the corresponding International Application No. PCT/JP2005/000052, mailed on Apr. 26, 2005.
Official communication issued in counterpart Chinese Application No. 2005800019083, mailed on Feb. 1, 2008.
Official communication issued in counterpart Chinese Application No. 2005800019083, mailed on Aug. 15, 2008.
Official communication issued in counterpart Japanese Application No. 2005-517630, mailed on Apr. 21, 2009.
Nishizawa Yoshihiko
Sakai Norio
Hu Shouxiang
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
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