Method of packaging semiconductor devices

Details Method of packaging semiconductor devices Method of packaging semiconductor devices

2007-01-05

2009-12-15

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

With vibration step

C438S118000, C438S127000, C438S106000, C257S682000, C257S758000, C257SE23135, C257SE21598

Reexamination Certificate

active

07632715

ABSTRACT:
A method of packaging a semiconductor includes providing a support structure. An adhesive layer is formed overlying the support structure and is in contact with the support structure. A plurality of semiconductor die is placed on the adhesive layer. The semiconductor die are laterally separated from each other and have electrical contacts that are in contact with the adhesive layer. A layer of encapsulating material is formed overlying and between the plurality of semiconductor die and has a distribution of filler material. A concentration of the filler material is increased in all areas laterally adjacent each of the plurality of semiconductor die.

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PCT Search report and Written Opinion for corresponding PCT Application No. PCT/US07/88282 mailed May 22, 2008.

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