Methods for repairing circuit board having defective...

Details Methods for repairing circuit board having defective... Methods for repairing circuit board having defective...

2006-11-21

2009-06-16

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S839000, C029S843000, C228S102000, C228S180100, C174S262000

Reexamination Certificate

active

07546682

ABSTRACT:
A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided, wherein at least one of the pre-soldering bumps has a defect. Then, a micro-electroplating process or a micro-electrolyzing process is performed by a micro-electrode nearby the defective pre-soldering bump, so as to repair the defective pre-soldering bump. Therefore, the present invention is able to enhance the process yield and reduce the production cost.

REFERENCES:
patent: 4630355 (1986-12-01), Johnson
patent: 4929845 (1990-05-01), Amir et al.
patent: 6211080 (2001-04-01), Tatah
patent: 6216938 (2001-04-01), Card et al.
patent: 6349871 (2002-02-01), Card et al.
patent: 6845556 (2005-01-01), Liang

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