Apparatus for testing un-moulded IC devices using air flow...

Details Apparatus for testing un-moulded IC devices using air flow... Apparatus for testing un-moulded IC devices using air flow...

2005-12-16

2009-02-03

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S755090, C324S758010

Reexamination Certificate

active

07486094

ABSTRACT:
An apparatus minimizes stress on un-moulded IC devices by use of an airflow system. A vacuum urges the DUT's into contact with the pivoted test fingers, thereby reducing damage to the IC. A fitting is connected to a vacuum pump which draws out air and creates a vacuum chamber in the area created by the lift/support and the test socket, thereby causing the supported un-moulded DUTs to move upward towards the test socket and into physical contact with the test pins. The index time is decreased in order to improve overall operating efficiency and costs of the test apparatus.

REFERENCES:
patent: 5528160 (1996-06-01), Fukumoto et al.
patent: 5894217 (1999-04-01), Igarashi et al.
patent: 6031384 (2000-02-01), Furuta

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