Semiconductor device

Details Semiconductor device Semiconductor device

2005-11-09

2009-06-23

Pizarro, Marcos D. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S508000, C257SE23002

Reexamination Certificate

active

07550850

ABSTRACT:
A semiconductor chip100includes a logic unit and an analog unit153. Furthermore, the semiconductor chip100includes a silicon substrate101; a first insulating film123to a sixth insulating film143formed on the silicon substrate101; and an annular seal ring105consisting of a first conductive ring125to a sixth conductive ring145buried in the first insulating film123to the sixth insulating film143, which surrounds the periphery of the logic unit and the analog unit153. In the seal ring region106, there is formed a pn junction acting as a nonconducting part104, which blocks conduction in a path from the logic unit, through the seal ring105to the analog unit153.

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