Embedded inductor devices and fabrication methods thereof

Details Embedded inductor devices and fabrication methods thereof Embedded inductor devices and fabrication methods thereof

2007-10-12

2009-06-23

Nguyen, Tuyen T. (Department: 2832)

Inductor devices

With electric and/or magnetic shielding means

Reexamination Certificate

active

07551052

ABSTRACT:
Embedded inductor devices and fabrication methods thereof. An embedded inductor device includes a substrate, a conductive coil disposed on the substrate, and a patterned high-permeability (μr>1) magnetic layer on the substrate. The patterned high-permeability (μr>1) magnetic layer physically contacts the conductive coil. The conductive coil and the patterned high-permeability (μr>1) magnetic layer are intersected and substantially perpendicular to each other.

REFERENCES:
patent: 5329020 (1994-07-01), Kalota et al.
patent: 6429763 (2002-08-01), Patel et al.
patent: 6593838 (2003-07-01), Yue
patent: 6593841 (2003-07-01), Mizoguchi et al.
patent: 7323948 (2008-01-01), Ding et al.
patent: 2002324962 (2002-11-01), None
patent: 2006190934 (2006-07-01), None
patent: 518616 (2003-01-01), None
patent: I245592 (2005-12-01), None
C. Patrick Yue et al, “On-Chip Spiral Inductors with Patterned Ground Shields for Si-Based RF IC's,” 1997 Symposium on VLSI Circuits Digest of Technical Papers, p. 85-86, US, 1997.
Egidio Ragonese et al, “Experimental Comparison of Substrate Structures for Inductors and Transformers,” IEEE MELECON 2004, p. 143-146, US, 2004.

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